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ensin product
ReiS Series (Sky LakeU)
型号：ReiS T12
主要特性
12″ full screen, fanless, precision die-cast aluminum, compact and sturdyAn innovative design to cover Intel 8th/7th/6th/Celeron mainstream computing platforms
Seamless welded heat dissipation from superconducting copper and die-cast aluminum tubes, preferred for harsh environment applications
Modular computing platform and I/O interfaces to easily build your solution
-Can independently install and detach hard drives, SIM cards, UPS batteries for localized operation and maintenance.
Localized hardware platform upgrade based on software computing requirements
相关产品
基本信息
| 尺 寸 ：12” | 内 存 ：1 x 2.5” SATAIII HDD&SSD + M.2 SSD 2 x 2.5” SATAIII HDD&SSD + mSATA SSD (Kaby Lake CPU) | I/O接口 ：6 x COM (COM1/2 3KV光隔, BIOS设置RS-232/485) 10x COM 4 x USB3.0, 2/4 x USB2.0 8/16路GPIO | |||
| C P U：Intel® 7th CoreTM i7 7500U 2.7GHz, 可睿频至3.5GHz, 4M Cache, TDP 15W Intel® 7th CoreTM i7 6500U 2.5GHz, 可睿频至3.1GHz,4M Cache, TDP 15W Intel® 6th CoreTM i5 6200U 2.3GHz, 可睿频至2.8GHz,3M Cache, TDP 15W Intel® 6th CoreTM i3 6100U 2.3GHz, 3M Cache, TDP 15W Intel® Ce | 硬 盘 ：1 x 2.5” SATAIII HDD&SSD + M.2 SSD 2 x 2.5” SATAIII HDD&SSD + mSATA SSD (Kaby Lake CPU) | 电 源 ：9-28VDC, 220VAC输入12V/5A输出电源适配器 (可选) |
规格参数
| 结构参数 | ||
| 散热设计 | 无风扇, 高性能铜管导热和压铸铝无缝散热 | |
| 安装方式 | Embedded, VESA（Optional） | |
| 外观尺寸(mm) | 307(宽) x 243(高) x 70(深)mm | |
| 柜体开孔(mm) | 299(宽) x 238 (高) mm | |
| 重量(Kg) | 2.5Kg (无UPS电池) | |
| 液晶屏 | ||
| 屏幕尺寸 | 12” | |
| 亮度 | 500cd/m2 | |
| 工作寿命 | 50000Hrs | |
| 可视角度 | 160/140 | |
| 触摸屏 | ||
| 类型 | 工业级全平面五线电阻触摸屏, 10点触控工业级电容屏 | |
| 系统性能 | ||
| 处理器 | Intel® 7th CoreTM i7 7500U 2.7GHz, 可睿频至3.5GHz, 4M Cache, TDP 15W Intel® 7th CoreTM i7 6500U 2.5GHz, 可睿频至3.1GHz,4M Cache, TDP 15W Intel® 6th CoreTM i5 6200U 2.3GHz, 可睿频至2.8GHz,3M Cache, TDP 15W Intel® 6th CoreTM i3 6100U 2.3GHz, 3M Cache, TDP 15W Intel® Ce | |
| 内存 | Intel® 7th CoreTM i7 7500U 2.7GHz, 可睿频至3.5GHz, 4M Cache, TDP 15W Intel® 7th CoreTM i7 6500U 2.5GHz, 可睿频至3.1GHz,4M Cache, TDP 15W Intel® 6th CoreTM i5 6200U 2.3GHz, 可睿频至2.8GHz,3M Cache, TDP 15W Intel® 6th CoreTM i3 6100U 2.3GHz, 3M Cache, TDP 15W Intel® Ce | |
| 存储 | 1 x 2.5” SATAIII HDD&SSD + M.2 SSD 2 x 2.5” SATAIII HDD&SSD + mSATA SSD (Kaby Lake CPU) | |
| 操作系统 | Windows 7, Windows 10, Ubuntu, etc. | |
| I/O接口 | ||
| 串口 | 6 x COM (COM1/2 3KV光隔, BIOS设置RS-232/485) 10x COM | |
| 网络 | LAN1 Intel I219LM 10/100/1000Mbps, 支持网络唤醒 LAN2 Intel I210 10/100/1000Mbps, 支持网络唤醒 LAN2~3 Intel I210 10/100/1000Mbps (Kaby Lake CPU) LAN2~4 Intel I210 10/100/1000Mbps, 支持网络唤醒 | |
| USB | 4 x USB3.0, 2/4 x USB2.0 | |
| 显示扩展 | Intel HD Graphics 620&520, DirectX12, OpenGL 4.5 1x VGA + 1x HDMI(可选), 2x VGA (Kaby Lake CPU) | |
| Audio | 1 x Mic+1 X Line Out, 1 x Mic+1 X 8Ω10W功放(Kaby Lake CPU) | |
| 扩展功能 | 1 x 全长Mini PCIe插槽 Nano SIM卡插槽 | |
| 供电方式 | ||
| 交流电源 | 9-28VDC, 220VAC输入12V/5A输出电源适配器 (可选) | |
| 功耗 | 最高功耗55W (i7 8565U CPU/ 8G Memory) | |
| 环境 | ||
| 工作环境 | -20~60℃ (选配固态硬盘), 0~40℃ (2.5”笔记本硬盘) | |
| 存储温度 | -30~70℃ | |
| 震动 | Half sine wave 3g, 11ms, 3 shock per axis | |
| 冲击 | 10G(11毫米周期半正弦波) | |
| 认证 | 品质认证 | CE, FCC, BIS |
| 信息 | 订购信息 | 订货号：T12-A1C1 cpu:3855U 内存：4G 硬盘：64G SSD 扩展硬盘：可选 网络：2 VGA:1 HDMI:1 串口：6 usb:7 GPIO:8 供电：9-28VDC MiniPCIe：1 UPS电池：可选 2米供电线：1 电源适配器：可选 订货号：T12-A2C2 cpu:i3 6100U 内存：4G 硬盘：128G SSD 扩展硬盘：可选 网络：2 VGA:1 HDMI:1 串口：6 usb:7 GPIO:8 供电：9-28VDC MiniPCIe：1 UPS电池：可选 2米供电线：可选 电源适配器：可选 订货号：T12-A3A2 cpu:i5 6200U 内存：4G 硬盘：128G SSD 扩展硬盘：可选 网络：2 VGA:1 HDMI:1 串口：6 usb:7 GPIO:8 供电：9-28VDC MiniPCIe：1 UPS电池：可选 2米供电线：可选 电源适配器：可选 |
产品介绍
12″ full screen, fanless, precision die-cast aluminum, compact and sturdy
An innovative design to cover Intel 8th/7th/6th/Celeron mainstream computing platforms
Seamless welded heat dissipation from superconducting copper and die-cast aluminum tubes, preferred for harsh environment applications
Modular computing platform and I/O interfaces to easily build your solution
-Can independently install and detach hard drives, SIM cards, UPS batteries for localized operation and maintenance.
Localized hardware platform upgrade based on software computing requirements
An innovative design to cover Intel 8th/7th/6th/Celeron mainstream computing platforms
Seamless welded heat dissipation from superconducting copper and die-cast aluminum tubes, preferred for harsh environment applications
Modular computing platform and I/O interfaces to easily build your solution
-Can independently install and detach hard drives, SIM cards, UPS batteries for localized operation and maintenance.
Localized hardware platform upgrade based on software computing requirements
